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TCA62753FUG TOSHIBA CMOS INTEGRATED CIRCIUTS SILICON MONOLITHIC
TCA62753FUG
Charge Pump type DC/DC Converter for White LED Driver
The TCA62753FUG is a charge pump type DC/DC Converter specially designed for constant current driving of White LED. This IC can outputs LED current 100mA to 3.0-5.5V input. This IC is especially for driving back light white LEDs in LCD of PDA, Cellular Phone, or Handy Terminal Equipment. This IC is Pb-free product.
Features
Power supply Voltage Output Voltage Output Current Switching Frequency Integrated protection circuit External parts are few. Package : VIN = 2.7V ~ 5.5V : VOUT = 5.0V 6% : 100mA (VIN = 3.0V or more) 50mA (VIN = 2.7V or more) : 1MHz (Typ.) : Thermal Shut Down function Over current limitation function
Weight: 0.016 g (Typ.)
: It is possible to driving of LED with 3 capacitors. (It is each one capacitor for the Input, for the Output, and for the Charge pump) : SSOP6-P-0.95B
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Pin Assignment (Top view)
C- 1
6 SHDN
Z
VIN 2
5 GND 4 VOUT
C+ 3
Explanation of the Terminal
No. Symbol Function
1 2 3 4 5
CVIN C+ VOUT GND
Capacitance connection terminal for charge pump. Power supply terminal. Capacitance connection terminal for charge pump. Output terminal. GND terminal. Logic input terminal. "H" input on this pin enables the IC to operate while "L" input causes it to shut down. The behavior of the IC is unpredictable if the input on the pin is undefined. Ensure that the pin is tied to either "H" or "L" level. In the condition of VIN = 2.7V or less, please make it to "L" level.
6
SHDN
Block Diagram
VIN 2 SHDN 6
Step up Circuit
3 C+ 1 C-
Control Circuit VREF
4 VOUT
5
GND
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I/O Equivalent Pin Circuits 1. C2. VIN
VIN C1 2
GND
5
3. C+
4. VOUT
C+
3
VOUT
4
6. SHDN
VIN
SHDN
3
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Absolute Maximum Ratings (Topr = 25C)
Characteristics Power supply voltage Symbol VIN VSHDN VOUT PD Rth (j-a) Topr Tstg Tj Ratings -0.3 ~ +6.0 -0.3 ~ VIN + 0.3 *Note1 -0.3 ~ +6.0 0.41 (Device) 0.47 (with PCB) *Note2 300 (Device) 260 (with PCB) -40 ~ +85 -55 ~ +150 150 Unit V V V W C/W C C C
Input Output Power
Voltage Voltage
Dissipation resistance
Thermal
Operating temperature range Storage temperature Maximum junction temperature
Note1: However, do not exceed 6V. Note2: When every time the ambient temperature gets over 25C with 1C, the allowable loss must reduce 3.8mW/C more than maximum rated value. (When on PCB.)
Recommended Operating Condition (unless otherwise specified, Topr = -40 ~ 85C)
Characteristics Power supply voltage
input output
Symbol VIN C CIN COUT
Test Conditions -
Min. 2.7 1.0 1.0
Typ. 1.0 2.2 2.2
Max. 5.5 10 10
Unit V mA F F
Capacitance for Charge Pump
Capacitance Capacitance for for
Electrical Characteristics (unless otherwise specified, VIN = 3.6V, Topr = 25C)
Characteristics Output Voltage Symbol VOUT IIN IIN VSHDNH VSHDNL ISHDNH ISHDNL fOSC ISC Test Conditions VIN = 2.7 ~ 3.0V, IOUT = 50mA or less VIN = 3.0 ~ 5.0V, IOUT = 100mA or less IOUT = 0mA, VSHDN = VIN VIN = 2.7 ~ 5.5V IOUT = 0mA, VSHDN = 0V VIN = 2.7 ~ 5.5V VIN = 2.7 ~ 5.5V VSHDN = VIN VSHDN = 0V VSHDN = 3.6V VOUT = GND, VSHDN = 3.6V Min. 4.7 4.7 1.3 0 -1 -1 0.7 1 250 Typ. 5.0 5.0 0.01 Max. 5.3 5.3 3 1 VIN 0.3 1 1 1.3 550 Unit V mA A V V A MHz mA
O p e r a ti ng c on s um p ti o n c ur r e n t Quiescent consumption current
SHDN terminal H level input voltage
SHDN terminal L level input voltage
SHDN t e r m i n a l
current
Clock Short
Frequency Current
Circuit
Note1: This characteristic is measured with the test circuit described to page 5.
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Test Circuit
ISHDN IIN VIN
A 1
CVIN C+
SHDN 6
GND 5 VOUT 4
COUT = 2.2F
A
C = 1.0F
2 3
VSHDN
CIN = 2.2F
IOUT
V
The example of Application Circuit
*These application examples are provided for reference only. *Thorough evaluation and testing should be implemented when designing your application's mass production design.
The example 1) Drive of 5 LEDs
SHDN
1
CVIN C+
SHDN
6
VIN = 3.0V ~ 5.0V
C = 1.0F
2 3
GND 5 VOUT 4
COUT = 2.2F
CIN = 2.2F
R
R
R
R
R
*The LED current becomes 20mA by R = 20. (For LED Vf = 3.6V)
The example 2) 5V power supply
SHDN
1
CVIN C+
SHDN 6
GND 5 VOUT 4
COUT = 2.2F VOUT = 5.0V 6% IOUT = 100mA
VIN = 3.0V ~ 5.0V
C = 1.0F
2 3
CIN = 2.2F
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Usage Precautions
About the capacitor Please connect C/CIN/COUT as much as possible near the pin for best performance. Please select the ceramic capacitor that ESR (Equivalent Series Resistor) is low. The input capacitor (CIN) is effective to decrease the impedance of power supply and also input current is averaged. The capacitance values of CIN will recommend 1.0F to 10F. The output capacitor (COUT) is effective to decrease the ripple noise of the output line. The capacitance values of COUT will recommend 1.0F to 10F. The flying capacitor (C) is a capacitor for the Step-up operation. The capacitance values of C will recommend 1.0F. Capacitance values of the ceramic capacitor changes greatly depending on the temperature and the input voltage. Please confirm necessary Capacitance values can be secured in all temperatures and the total applied voltages.
About the output ability
This product outputs 5V 6% from the terminal VOUT in input voltage VIN = 2.7V or more. The output current ability is 50mA at VIN = 2.7V ~ 3.0V. Moreover, it is 100mA at VIN = 3.0V or more.
Thermal shutdown function
The thermal shutdown circuit works when the junction temperature exceeds 150C (Typ.), and IC stops operating. Operation begins again when the junction temperature falls. (This function is not included in the product inspection.) *When the capacitor connected with C+ terminal and C- terminal comes off. The step up operation is not done. The power supply current flows because the current route is generated from the terminal VIN to the terminal GND / the terminal VOUT. However, the over current limitation function works, and the power supply current is limited to 250mA (Typ.). *When the capacitor connected with I/O comes off The step up operation is done. However, the voltage ripple of I/O grows, and the output ability decreases. *When terminal C+ and terminal C- are short-circuited The step up operation is not done. The power supply current flows because the current route is generated from the terminal VIN to the terminal GND. However, the over current limitation function works, and the power supply current is limited to 250mA (Typ.). *When the terminal SHDN is an opening The behavior of the IC is unpredictable if the input on the pin is undefined. Ensure that the pin is tied to either "H" or "L" level. *When the terminal VOUT is short-circuited to GND The over current limitation function works, and the power supply current is limited to 250mA (Typ.). *When the terminal VOUT is an opening The output voltage is controlled with 5V 6%.
Others
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Reference data
*This data is a reference value, and no guarantee value.
Output Current - Output Voltage
5.2 5.1 V OUT (V)
Power supply Voltage - Output Voltage
5.2 5.1 V OUT (V)
IOUT=0mA
5.0 4.9 4.8 0 50 IOUT (mA) 100
VIN=3.2V VIN=2.7V
5.0 4.9
IOUT=50mA IOUT=100mA
2.7 3.1 3.5 3.9 4.3 V IN (V) 4.7 5.1 5.5
VIN=3.0V
4.8 150
Output Current - Efficiency
100 Efficiency (%) 80 60 40 20 0 10 40 IOUT (mA) 70 100
Power supply Voltage - Efficiency
100
VIN=2.7V VIN=3.2V
VIN=3.0V
Efficiency (%)
IOUT=50mA
80 60 40 20 0 2.7 3.1 3.5 3.9 4.3 V IN (V) 4.7 5.1 5.5
IOUT=100mA
Power supply Voltage - Input Current
3.0 2.5 IQ (mA) 2.0 1.5 1.0 0.5 0.0 2.7 3.1 3.5 3.9 4.3 V IN (V)
Oscillator Frequency (MHz)
1.5 1.3 1.1 0.9 0.7 0.5
Power supply Voltage - Clock Freq enc
Ta=25C Ta=85C Ta=-40C
IOUT=0mA
VSHDN=VIN
4.7 5.1 5.5
2.7
3.1
3.5
3.9 4.3 V IN (V)
4.7
5.1
5.5
Evaluation conditions Ta = 25C (unless otherwise specified) C = 1.0F (TDK Corporation C1608JB1C105K) C1608JB0J225M) CIN/COUT = 2.2F (TDK Corporation
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Package Dimensions
Weight: 0.016 g (Typ.)
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Notes on Contents
1. Block Diagrams 2. Equivalent Circuits
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits.
3. Application Circuits
4. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
IC Usage Considerations
Notes on handling of ICs
[1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. [3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. [4] Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. [5] Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.
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